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Jan.27,2005

NEWLONG run a booth at INTERNEPCON 2005.

The 34th Internepcon Japan took place at Tokyo Big Sight for three days from Jan. 19 (Wed.) to 21 (Fri.), 2005, and NEWLONG run a booth there this year again.

There was a great turnout in the three days of Internepcon from the first day - 988 exhibitors and 57,921 visitors, which are larger than the last year - along with the newly and concurrently held International Fuel Cell Expo, which is a hot industry.

This time, NEWLONG SEIMITSU KOGYO Co., Ltd. displayed demonstrations of:

1. High-precision screen-printer with auto alignment;
• LS-150TVA
2. High-precision screen-printer with auto alignment;
• LS-34TVA (with wafer carrier robot)
3. Vacuum screen-printer with auto alignment;
• LS-340VTVA
4. (NEW!!) Squeegee grinding machine;
• SG-200HR

together with peripheral devices, printed samples and so on.

Among those displays, LS-340VTVA the vacuum screen-printer with auto alignment and the samples and panels of "WL-CSP (Wafer Level Chip Scale Packaging) redistribution" printed by using LS-34TVA, which NEWLONG, in conjunction with the mask and paste manufacturers, have developed since last year received great response and inquiries.

Thank you for taking time in your busy schedule to visit our booth.

Also, please feel free to inquire of the sales department about your questions, printing tests, estimates, etc. for any screen-printers other than these entries.

Click here to visit Internepcon Japan.

WL-CSP (Wafer Level Chip Scale Packaging) redistribution sample by LS-34TVA

NEWLONG's booth (inside)

LS-34TVA with wafer carrier robot

NEWLONG's booth (exterior) 1

NEWLONG's booth (exterior) 2